Introduction to Products


Semiconductor Equipment

pre-processing

  • Silicon ingots

  • Silicon slices

MWS Series


  • Silicon abrasives

  • Finished silicon wafers
  • Insertion of silicon wafers
  • Creating the membrane using thin membrane technology
  • Resist-coating
  • Photo lithography
  • Introduction of impurities
  • Inspection of characteristics

post-processing

Protective tape lamination

Before applying the abrasive to the surface of the wafer, tape is affixed to protect the surface.

TEAM-100

ATM-1100G

ATM-3000

Attach wafers and substrate

Attach wafers and substrate in vacuum.

WSM-100

GWS-300M

GWSM-300M



Grinding the under surface of the wafer

The under surface is ground to produce a lighter and thinner wafer.



Removing the protective surface tape

The tape that was affixed to protect the wafer’s surface is removed.

ATRM-2300

ATRM-2200G

ATRM-4000

After DAF is attached to the rear surface of the wafer, the wafer is fixed to the dicing frame.
After this, the protection tape is removed from the front surface in a continuous operation.
Substrates are detached from wafers without any stress.
No stress is given to wafers while substrates are separated.



Die sheet lamination (Stacked IC)

Laminating die sheet on the backside of the wafer

DM-800B

DM-812

DAM-812M



Wafer mount for dicing

It is affixed to the dicing frame and secured.

ATM-8200

ATM-8100S

SAM-8

Detaching ultra thin wafers from substrates without any stress.

ATM-8100X

ATM-12000DR

Substrate Detaching




Dicing the wafer

The wafer is cut and inspected, with only those wafers that are found to be good upon inspection being used for chips


UV irradiation

For UV tape, applying UV irradiation before pick-up

TUV-1

TUV-M

TUV-12

一般半導体工程 CSP、BGA工程

General Semiconductor Processing

Wire Bonding

The chip and lead frame are connected using bonding wire (gold wire of approximately 25 μm thickness, etc.).


Packaging

The chip is inserted into a package made of ceramic, resin, etc.


Finished IC package

The semiconductor undergoes product and reliability inspections, and is finished after passing the inspections.


CSP (Chip Size Package) Process

Dry resist tape lamination

Laminate dry-resist film on wafer

ATM-1100K

VTM-300


Pump formation

Dicing the wafer

The wafer is cut and inspected, with only those wafers that are found to be good upon inspection being used for chips


UV irradiation

For UV tape, applying UV irradiation before pick-up

TUV-1

TUV-M

TUV-12

Finished IC package

The semiconductor undergoes product and reliability inspections, and is finished after passing the inspections.


BGA Processing

Packaging

The chip is inserted into a package made of ceramic, resin, etc.


Substrate mounting for dicing

In order to prepare for dicing, tape is laminated onto frame and it is mounted.

ATM-9500


Dicing

The package is cut and separated.

Placement in tray

CSP completion

After passing product and reliability inspections the CSP package is finished.


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