FEATURES
This machine mounts wafers which are attached with substrate in vacuum chamber, then irradiate UV(or heat), then detach wafers and substrates.
No stress to wafers by Takatori unique thin wafer handling, vacuum element, vacuum chamber.
It can be used with HBM wafer support.
TAIKO® is a registered trademark of DISCO Corporation in Japan and other countries.
Equipment applicable to TAIKO® Process
Wafer Protective Tape Lamination Machines
Wafer Protective Tape Removal Machines
Film Resist Lamination Machines
Equipment applicable to Substrate (H-WSS) Processing (Attaching)
Equipment applicable to Substrate (H-WSS) Processing (Detaching)
