Introduction to Products



  • Full automatic mounter for processing 12-inch (300 mm) wafers.
  • Mounting a wafer, and then removing protective tape.
  • No damage due to lamination roller on ultra thin and no air bubbles because of adopting vacuum chamber.
  • Operations for replacing tape and supplying frames are centralized on the back of the machine.
  • FOUP carrier. (option)
  • In-line docking with B/G device, etching and polishing devices.
  • Taking out wafers from a coin stacker. (option)

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