Introduction to Products



  • Contactless mounting table which holds wafer at 3mm edge part. (Vacuum for wafer holding is not necessary.)
  • The adoption of a vacuum chamber system allows for reduced stress on the attachment rollers and the elimination of air bubbles, thereby preventing damage to the wafers and packages.
  • Tension control for all types of tapes is possible, so the optimal coating can be achieved to match post-processing requirements.
  • Automatic tape supply, tape coiling, wastage tape coiling, tape cutting.(UV tape applicable)
  • Applicable for thin wafer.

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