Takatori's Core Tecnologies


Tape Removal Technology

Tape Removal Technology

In removal technology, control systems for heat, pressure, tape removal angle and removal speed allows the removal of back grinding tape from wafers, as well as cover sheets and laminate films from dry resist film and other wide ranging materials.

Static Elimination Technology

Static Elimination

By adopting static elimination technology, static generated through film removal is eliminated instantly so as to not damage wafers and LCD panels. Moreover, special vacuum tables allow film removal from workpieces without inducing stress during the removal process.