Takatori's Core Tecnologies


Lamination

Heating / Pressurization Lamination Technology

Heating / Pressurization Lamination Technology

By using the properties of temperature, pressure and speed control with a heated roller and heated table, a wide range of tape types can be utilized.


Tension Control Technology

Tension ControlTechnology

By utilizing special tape chucks, fine tension control techniques can be used, thus allowing the use of rigid and thick tapes as well as the handling of anisotropic conduction films (ACF), etc.


Heat Compression Technology

Heat Compression Technology

The use of special heating systems allows TCP/FPC films to be positioned precisely and attached to PCB boards. Plus, precise, automatic control systems for pressure, temperature and speed allows accurate heat bonding.


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