In the production of MEMS, it is important to form the resist layer with appropriate shape on a three-dimensional structure. The sticking method can be selected in the device of our company that difficultly consolidates "Dry film sticking technology" by correspondence to the three-dimensional architecture in a past coater technology and developed according to “tenting”, the burial, and the thick film, conformal, and the purpose.
MEMS Dry Film Resist (Permanent Film) Lamination Machines
