We are pleased to announce that we will be exhibiting at SEMICON Japan 2025, held from December 17 to 19, 2025.
We look forward to welcoming you at our booth.
【Exhibit Highlights】
We will showcase actual equipment supporting panel-level packaging (PLP), along with our latest solutions for both advanced semiconductor processes and legacy processes.
・Exhibited items will include:
・Vacuum laminator for PLP
・Tape laminators and removers
・Glass bonder / debonder
・Wafer mounters
・Multi wire saw
・Grinder
And more
【Exhibition Information】
Dates: December 17 (Wed) - December 19 (Fri), 2025
Venue: Tokyo Big Sight
Booth No.: E6421 (East Hall 6)
