Noteworthy Information


We will exhibit at SEMICON Europa 2025

Advanced Materials Equipment Company:
We will be exhibiting a panel of the MWS-SiC6, a wire saw specifically designed for SiC that can cut up to 8 inches. It can use thin wires of 70 μm, which will greatly contribute to reducing slicing costs.

Dates: November 18th (Tuesday) to 21st (Friday), 2025

Venue: Messe Muenchen
Booth No. : C1261

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