Introduction to Products


Wafer Mounter  

FEATURES

  • A unique vacuum type mounting method also enables bubble-free application of tape to areas of different height between the grinding surface and ribs around the outer circumference of the rear surface of the wafer.
  • Contamination of the front and rear surfaces is prevented thanks to the use of a unique transfer system that only suctions the rib areas around the outer circumference of the rear surface of the wafer.
  • In addition, customized specifications can be created to meet client requests.


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