ATM-9000｜Semiconductor Equipment｜Introduction to Products｜Takatori Corporation

Introduction to Products

ATM-9000　

FEATURES

Lamination in vacuum state allows bubble-free lamination even on different levels.
Multiple package lamination is available.
Applicable to ECO ring allowing lamination without wasting tape.

Semiconductor Equipment

New model lineup

Equipment applicable to LED

Equipment applicable to TAIKO Process

Wafer Protective Tape Lamination Machines

Wafer Protective Tape Removal Machines

UV Irradiation Equipment

Film Resist Lamination Machines

Package Mounters

Equipment applicable to Substrate (H-WSS) Processing (Attaching)

Equipment applicable to Substrate (H-WSS) Processing (Detaching)

Advanced Materials Manufacturing Equipment

Display Equipment

Textile Equipment

Medical Devices