Adoption of Cell System The cell system grinds 1 wafer at a time. The machine can be used manually with setting the wafer to the table or automatically by setting wafer carriers.
High Rigidity Machine The high rigidity machine can grind hard brittle material like SiC, GaN, and sapphire. The machine will grind with heavy load, which leads to less grinding time, higher accuracy, and long life of grind stones. The rotating head and table can be set-up to low speed to high speed rotation.
Non-Dress Realized longer life of grindstone and shorter grinding time, by using non-dress grindstone.
Easier Operation The machine uses graphical user interface (GUI) which is user-friendly, and flexible data setting is available.
Eco-Friendly Smaller motor capacity by using servo-motor, which also means less irregularity of spinning that leads to stabilization of grinding face.
