FEATURES
Easy operation for anybody
World 1st fully automatic grinder achieving labor-saving and space-saving.
・Available to grind up to MAX. 8 in (Dia. 205mm)
・2 axis and 3 chuck tables feature best suited for rough and finishing grinding.
・High rigid structure brings fast and precise grinding.
・Labot-saving and space-saving designed (occupies 3.07m2)
・Fully automatic grinding wheel changed is achieved. (applying patent)
・Simultaneously optimized grinding while inspecting wafer.
・Road port adopted with SMIF is available as an option.
