Introduction to Products


Surface Protection Tape Removal Machine  ATRM-2300

FEATURES

  • Damage to wafers is prevented thanks to the adoption of proprietary transfer technology suited to the TAIKO process as well as unique stage-based removal technology that eliminates contact with the grinding surface.
  • The ATRM-2300 achieves a significant reduction in the volume of removal tape used (removal tape saving mechanism).
    It also contributes to reduced running costs.
  • The system can also be configured for a non-contact hand and UV exposure function (options).
  • In addition, customized specifications can be created to meet client requests.


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