- Best applied to large-size ingot
Capable of slicing:
・One piece of 440mm(L)×156mm(H)×500mm(W) sized material
・Two pieces of 156mm(L)× 156mm(H)×500mm(W) sized material
(Depends on hardness etc.)
Resulting minimal kerfloss,MWS-4450DD is able to slice various large-size materials such as solar silicon,neodymium magnet,glass,and ceramic.
- Suggestion of fixed abrasive cutting
Using the know-how of fixed abrasive cutting as an aside to the machine design allows higt-speed high-precision cutting.
- Work parallel cutting
Adopts parallel cutting whose difficulty is said relatively high.
Takatori's unique technology allows mass cutting although the machine size is compact.
- Dual spindle structure
Able to cut two pieces of 500mmL work with dual spindle realizing reduction of maintenance time and cost.
- Improved main spindle rigidity
High rigid spindle and both-end support structure allows to cut ultra thin solar silicon.
High precision cooling feature secures heat issue.
- Wire tension stability
Adopts Takatori unique wire tension feed-back method.
Full electronic sontrolling system allows stable cutting regardless of thin wire.
for use in slicing other materials
for use in slicing solar silicon
